This course introduces the theory and technology of micro/nano fabrication. Because of the interdisciplinary nature of the subject, its content includes concepts from many disciplines in engineering (electrical, materials, mechanical, chemical) and science. In this course, we will discuss the theory of basic processing techniques, such as diffusion, oxidation, photolithography, chemical vapor deposition, physical vapor deposition, etching, and metallization.
Course Content
This course contains; ,Oxidation,Diffusion,Vacuum Systems,Chemical Vapor Diffusion,Sputtering,Evaporation,Lithography-II,Soft Lithography,Etching (wet),Etching (dry),Complementary metal-oxide-semiconductor (CMOS),Advanced Silicon Devices,Applications of Silicon Devices,Hot Topics in Micro and Nanofabrications-I,Hot topics in Micro and Nanofabrications-II.
Dersin Öğrenme Kazanımları
Teaching Methods
Assessment Methods
Recognizes modern CMOS manufacturing technology, process integration and production flow diagrams
10, 12, 14, 16, 19, 21
A
Recognize the process modeling tools, device characterization and inspection techniques.
12, 16, 19, 9
A
Compare the mask layouts, and understand the reasons for layout rules in VLSI design.
12, 13, 19
A
Identify the performance metrics for each unit process
12, 16, 19, 9
Evaluates the fundamental theory and operation of equipments used in different microelectronic processes.
12, 14, 19, 9
A
Recognize the unit processes involved in IC fabrication, including diffusion, oxidation, ion implantation, lithography, dry/wet etching, physical and chemical vapor deposition techniques.
12, 14, 19, 21, 9
A
Teaching Methods:
10: Discussion Method, 12: Problem Solving Method, 13: Case Study Method, 14: Self Study Method, 16: Question - Answer Technique, 19: Brainstorming Technique, 21: Simulation Technique, 9: Lecture Method
Assessment Methods:
A: Traditional Written Exam
Course Outline
Order
Subjects
Preliminary Work
0
1
Oxidation
2
Diffusion
3
Vacuum Systems
4
Chemical Vapor Diffusion
5
Sputtering
6
Evaporation
7
Lithography-II
8
Soft Lithography
8
Etching (wet)
9
Etching (dry)
10
Complementary metal-oxide-semiconductor (CMOS)
11
Advanced Silicon Devices
12
Applications of Silicon Devices
13
Hot Topics in Micro and Nanofabrications-I
14
Hot topics in Micro and Nanofabrications-II
Resources
S.A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press //// R. C. Jaeger, Introduction to Microelectronic Fabrication //// J. D. Plummer, M. D. Deal and P. B. Griffin, Silicon VLSI Technology Fundamentals, Practice and Models, Prentice Hall, 2000.
S. M. Sze, VLSI Technology, McGraw Hill
Course Contribution to Program Qualifications
Course Contribution to Program Qualifications
No
Program Qualification
Contribution Level
1
2
3
4
5
1
An ability to apply knowledge of mathematics, science, and engineering
X
2
An ability to identify, formulate, and solve engineering problems
X
3
An ability to design a system, component, or process to meet desired needs within realistic constraints such as economic, environmental, social, political, ethical, health and safety, manufacturability, and sustainability
X
4
An ability to use the techniques, skills, and modern engineering tools necessary for engineering practice
X
5
An ability to use the techniques, skills, and modern engineering tools necessary for engineering practice
X
6
An ability to function on multidisciplinary teams
X
7
An ability to communicate effectively
X
8
A recognition of the need for, and an ability to engage in life-long learning
X
9
An understanding of professional and ethical responsibility
X
10
A knowledge of contemporary issues
X
11
The broad education necessary to understand the impact of engineering solutions in a global, economic, environmental, and societal context
X
12
Capability to apply and decide on engineering principals while understanding and rehabilitating the human body
X
Assessment Methods
Contribution Level
Absolute Evaluation
Rate of Midterm Exam to Success
30
Rate of Final Exam to Success
70
Total
100
ECTS / Workload Table
Activities
Number of
Duration(Hour)
Total Workload(Hour)
Course Hours
14
3
42
Guided Problem Solving
0
0
0
Resolution of Homework Problems and Submission as a Report
10
4
40
Term Project
0
0
0
Presentation of Project / Seminar
0
0
0
Quiz
0
0
0
Midterm Exam
1
49
49
General Exam
1
40
40
Performance Task, Maintenance Plan
1
2
2
Total Workload(Hour)
173
Dersin AKTS Kredisi = Toplam İş Yükü (Saat)/30*=(173/30)
6
ECTS of the course: 30 hours of work is counted as 1 ECTS credit.
Detail Informations of the Course
Course Description
Course
Code
Semester
T+P (Hour)
Credit
ECTS
MICRO and NANOFABRICATION
-
Fall Semester
3+0
3
6
Course Program
Prerequisites Courses
Recommended Elective Courses
Language of Course
English
Course Level
First Cycle (Bachelor's Degree)
Course Type
Elective
Course Coordinator
Assoc.Prof. Hasan KURT
Name of Lecturer(s)
Assoc.Prof. Hasan KURT
Assistant(s)
Aim
This course introduces the theory and technology of micro/nano fabrication. Because of the interdisciplinary nature of the subject, its content includes concepts from many disciplines in engineering (electrical, materials, mechanical, chemical) and science. In this course, we will discuss the theory of basic processing techniques, such as diffusion, oxidation, photolithography, chemical vapor deposition, physical vapor deposition, etching, and metallization.
Course Content
This course contains; ,Oxidation,Diffusion,Vacuum Systems,Chemical Vapor Diffusion,Sputtering,Evaporation,Lithography-II,Soft Lithography,Etching (wet),Etching (dry),Complementary metal-oxide-semiconductor (CMOS),Advanced Silicon Devices,Applications of Silicon Devices,Hot Topics in Micro and Nanofabrications-I,Hot topics in Micro and Nanofabrications-II.
Dersin Öğrenme Kazanımları
Teaching Methods
Assessment Methods
Recognizes modern CMOS manufacturing technology, process integration and production flow diagrams
10, 12, 14, 16, 19, 21
A
Recognize the process modeling tools, device characterization and inspection techniques.
12, 16, 19, 9
A
Compare the mask layouts, and understand the reasons for layout rules in VLSI design.
12, 13, 19
A
Identify the performance metrics for each unit process
12, 16, 19, 9
Evaluates the fundamental theory and operation of equipments used in different microelectronic processes.
12, 14, 19, 9
A
Recognize the unit processes involved in IC fabrication, including diffusion, oxidation, ion implantation, lithography, dry/wet etching, physical and chemical vapor deposition techniques.
12, 14, 19, 21, 9
A
Teaching Methods:
10: Discussion Method, 12: Problem Solving Method, 13: Case Study Method, 14: Self Study Method, 16: Question - Answer Technique, 19: Brainstorming Technique, 21: Simulation Technique, 9: Lecture Method
Assessment Methods:
A: Traditional Written Exam
Course Outline
Order
Subjects
Preliminary Work
0
1
Oxidation
2
Diffusion
3
Vacuum Systems
4
Chemical Vapor Diffusion
5
Sputtering
6
Evaporation
7
Lithography-II
8
Soft Lithography
8
Etching (wet)
9
Etching (dry)
10
Complementary metal-oxide-semiconductor (CMOS)
11
Advanced Silicon Devices
12
Applications of Silicon Devices
13
Hot Topics in Micro and Nanofabrications-I
14
Hot topics in Micro and Nanofabrications-II
Resources
S.A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press //// R. C. Jaeger, Introduction to Microelectronic Fabrication //// J. D. Plummer, M. D. Deal and P. B. Griffin, Silicon VLSI Technology Fundamentals, Practice and Models, Prentice Hall, 2000.
S. M. Sze, VLSI Technology, McGraw Hill
Course Contribution to Program Qualifications
Course Contribution to Program Qualifications
No
Program Qualification
Contribution Level
1
2
3
4
5
1
An ability to apply knowledge of mathematics, science, and engineering
X
2
An ability to identify, formulate, and solve engineering problems
X
3
An ability to design a system, component, or process to meet desired needs within realistic constraints such as economic, environmental, social, political, ethical, health and safety, manufacturability, and sustainability
X
4
An ability to use the techniques, skills, and modern engineering tools necessary for engineering practice
X
5
An ability to use the techniques, skills, and modern engineering tools necessary for engineering practice
X
6
An ability to function on multidisciplinary teams
X
7
An ability to communicate effectively
X
8
A recognition of the need for, and an ability to engage in life-long learning
X
9
An understanding of professional and ethical responsibility
X
10
A knowledge of contemporary issues
X
11
The broad education necessary to understand the impact of engineering solutions in a global, economic, environmental, and societal context
X
12
Capability to apply and decide on engineering principals while understanding and rehabilitating the human body
